STERLING, Va. July 19, 2011
As line widths of these devices continue to shrink, the current techniques used to deconstruct a semiconductor die become impractical. 4Wave’s ion beam de-layering system has the ability to remove an entire die layer, regardless of the material composition exposing the underlying circuit.
Continued investment in developing processes has allowed 4Wave to demonstrate equipment capabilities to potential customers and successfully deliver systems with production ready processes. This business model enables 4Wave’s customers to shorten their product development cycle and/or rapidly qualify the equipment for their production needs.
the United States
Sterling, Virginia www.4waveinc.com
SOURCE 4Wave, Inc.