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Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the Fourth Quarter and Full Year of 2010

TAIPEI, Taiwan Jan. 28, 2011 NT$53,283 million NT$4,962 million NT$3,450 million NT$5,460 million NT$0.82 US$0.134 NT$0.60 NT$0.91

NT$188,743 million NT$18,430 million NT$3.05 US$0.484

Republic of China

RESULTS OF OPERATIONS

4 Q 10 Results Highlights Actual Basis

  • NT$26,003 million NT$5,989 million NT$17,226 million NT$583 million NT$3,482 million
  • NT$41,381 million
    • NT$24,338 million NT$24,980 million
    • NT$5,385 million NT$5,435 million
    • NT$5,156 million
    • NT$1,395 million
  • NT$4,612 million NT$1,665 million NT$2,947 million NT$4,440 million NT$156 million
  • NT$7,290 million NT$6,665 million
    • NT$316 million NT$281 million
    • NT$137 million
    • NT$7 million
    • NT$132 million NT$318 million NT$66 million NT$190 million
  • NT$6,972 million NT$6,475 million NT$1,777 million NT$771 million NT$916 million
  • NT$4,962 million NT$3,450 million NT$5,460 million
  • NT$0.82 US$0.134

4 Q 10 Results Highlights IC ATM (2) Basis

  • NT$26,025 million NT$5,994 million NT$583 million
  • NT$24,457 million
    • NT$10,249 million NT$10,801 million
    • NT$4,815 million NT$4,889 million
    • NT$4,797 million
  • NT$3,247 million NT$1,264 million NT$1,983 million NT$3,213 million
  • NT$4,898 million NT$5,890 million

(2) ATM stands for Semiconductor Assembly, Testing and Material.

4 Q 1 Results Highlights of USI

  • NT$17,228 million
  • NT$15,424 million
    • NT$14,115 million NT$14,191 million
    • NT$570 million NT$546 million
    • NT$205 million
  • NT$1,154 million NT$401 million NT$753 million NT$1,131 million
  • NT$650 million NT$968 million

20 10 Full- Y ear Results Actual Basis

  • NT$188,743 million NT$101,071 million NT$21,957 million NT$59,577 million NT$2,656 million NT$3,482 million
  • NT$148,264 million NT$67,444 million
    • NT$88,556 million NT$25,536 million
    • NT$20,460 million NT$12,897 million
    • NT$18,584 million NT$16,603 million
  • NT$16,482 million NT$6,194 million NT$10,288 million
  • NT$23,997 million NT$9,199
  • NT$1,093 million NT$811 million
  • NT$22,904 million NT$3,615 million
  • NT$18,430 million NT$6,744 million
  • NT$3.05 US$0.484

20 10 Full- Y ear Results– IC ATM (3) Basis

  • NT$125,737 million NT$101,119 million NT$21,962 million NT$2,656 million
  • NT$93,738 million NT$67,444 million
    • NT$40,214 million NT$25,536 million
    • NT$18,483 million NT$12,897 million
    • NT$17,363 million NT$16,603 million
  • NT$12,025 million NT$4,702 million NT$7,323 million
  • NT$19,974 million NT$9,199

(3) ATM stands for Semiconductor Assembly, Testing and Material.

20 10 Full- Y ear Results of USI

  • NT$63,946 million
  • NT$56,667 million
    • NT$51,921 million NT$41,589 million
    • NT$2,123 million NT$1,701 million
    • NT$923 million NT$1,231 million
  • NT$4,489 million NT$1,623 million NT$2,866 million
  • NT$2,790 million NT$1,855

LIQUIdiTY AND CAPITAL RESOURCES of Actual Basis

  • December 31, 2010 NT$25,810 million NT$29,353 million September 30, 2010
  • US$133 million US$72 million US$47 million US$11 million US$3 million
  • US$954 million US$621 million US$289 million US$32 million US$12 million
  • December 31, 2010 NT$70,916 million NT$80,510 million September 30, 2010 NT$14,738 million NT$3,136 million NT$53,042 million NT$100,672 million
  • December 31, 2010 September 30, 2010 December 31, 2010
  • December 31, 2010 September 30, 2010

Business Review

IC Packaging Services (4)

  • NT$26,025 million NT$4,894 million NT$1,276 million
  • Net revenues from advanced substrate and leadframe-based packaging accounted for 83% of total IC packaging net revenues during the quarter, down by 1 percentage point from the previous quarter.
  • Gross margin for our IC packaging operations during the quarter was 21%, the same as the same quarter last year and down by 1 percentage point from the previous quarter.
  • US$72 million US$60 million US$12 million
  • December 31, 2010
  • Net revenues from flip chip packages and wafer bumping services accounted for 17% of total packaging net revenues, up by 1 percentage point from the previous quarter.

(4) IC packaging services include module assembly services.

Testing Services

  • NT$5,994 million NT$1,431 million NT$23 million
  • Final testing contributed 84% to total testing net revenues, down by 1 percentage point from the previous quarter.  Wafer sort contributed 14% to total testing net revenues, up by 1 percentage point from the previous quarter.  Engineering testing contributed 2% to total testing net revenues, which remained the same as the previous quarter.
  • NT$1,706 million NT$1,414 million NT$1,585 million
  • In 4Q10, gross margin for our testing operations was 37%, up by 2 percentage points year-over-year and down by 2 percentage points from the previous quarter.
  • US$47 million
  • December 31, 2010

EMS Services

  • NT$17,228 million NT$2,258 million NT$258 million
  • Electronics Packaging & EMS products contributed 19% to total EMS net revenues, down by 1 percentage point from the previous quarter. Computers & Peripherals products contributed 12% to total EMS net revenues, down by 1 percentage point from the previous quarter.  Communications products contributed 43% to total EMS net revenues, up by 6 percentage points from the previous quarter. Network Storage & Servers products contributed 8% to total EMS net revenues, down by 2 percentage points from the previous quarter. Industrial & Automotive products contributed 18% to total EMS net revenues, down by 2 percentage points from the previous quarter.
  • In 4Q10, gross margin for our EMS operations was 11%, the same as the same quarter last year and down by one percentage point from the previous quarter.
  • US$11 million

Substrate Operation s

  • NT$2,445 million NT$148 million NT$224 million NT$2,445 million NT$584 million
  • Gross margin for substrate operations was 23% during the quarter, down by 2 percentage points year-over-year and sequentially.
  • In 4Q10, our internal substrate manufacturing operations supplied 46% (by value) of our total substrate requirements.

Customers

IC ATM consolidated Basis

  • Our five largest customers together accounted for approximately 30% of our total net revenues in 4Q10, compared to 28% in 4Q09 and 28% in 3Q10.  No single customer accounted for more than 10% of our total net revenues.
  • Our top 10 customers contributed 46% of our total net revenues during the quarter, compared to 43% in 4Q09 and 44% in 3Q10.
  • Our customers that are integrated device manufacturers, or IDMs, accounted for 39% of our total net revenues during the quarter, compared to 39% in 4Q09 and 38% in 3Q10.

EMS Basis

  • Our five largest customers together accounted for approximately 65% of our total net revenues in 4Q10, compared to 66% in 4Q09 and 62% in 3Q10. There were two customers, which accounted for more than 10% of our total net revenues.
  • Our top 10 customers contributed 81% of our total net revenues during the quarter, compared to 83% in 4Q09 and 78% in 3Q10.

About ASE, Inc.

ASE , Inc. is the world s largest independent provider of IC packaging services and testing services, including front-end engineering testing, wafer probing and final testing services. ASE, Inc. s international customer base of more than 200 customers include s such leading names as ATI Technologies Inc., MediaTek Inc., Broadcom Corporation, NVIDIA Corporation, NXP Semiconductors, Qualcomm Incorporated , Renesas Electronics Cor por ation, RF Micro Devices Inc. and STMicroelectronics N.V.  With advanced Taiwan China , Korea, Japan Singapore Malaysia the United States , Inc. has established a reputation for reliable, high quality products and services. For more information, visit our website at http://www.aseglobal.com .

Safe Harbor Notice

Republic of China the People’s Republic of China June 11, 2010

Supplemental Financial Information

IC ATM Consolidated Operations

Amounts in NT$ Millions

4Q/10

3Q/10

4Q/09

Net Revenues

32,602

34,015

26,293

Revenues by End Application

Communication s

50%

48%

45%

Computer s

15%

16%

22%

Automotive and Consumer

34%

36%

33%

Others

1%

0%

0%

Revenues by Region

North America

54%

54%

50%

Europe

14%

14%

13%

Taiwan

17%

18%

21%

Japan

9%

9%

10%

Other Asia

6%

5%

6%

IC Packaging Services

Amounts in NT$ Millions

4Q/10

3Q/10

4Q/09

Net Revenues

26,025

27,301

21,131

Revenues by Packaging Type

Advanced substrate & leadframe based

83%

84%

87%

Traditional leadframe based

9%

8%

6%

Module assembly

5%

5%

4%

Others

3%

3%

3%

Capacity

CapEx (US$ Millions)*

72

185

139

Number of Wirebonders

10,903

11,467

9,515

Testing Services

Amounts in NT$ Millions

4Q/10

3Q/10

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