MOUNTAIN VIEW, Calif. Feb. 7, 2011
The User Equipment (UE) reference architecture targets both LTE FDD and LTE TDD up to category-4 with ultra-low power consumption and silicon cost to meet the strict requirements of mobile devices. Furthermore, the solution can be easily scaled down to TDD mode only or lower LTE categories to offer an additional cost and power saving. In 40nm LP process, the silicon area of a CEVA-XC based LTE UE can be as low as 4mm2 with a power consumption of less than 200mW for Cat-4 PHY system (20 MHz bandwidth, MIMO 2×2, 150 Mbit/sec). CEVA and mimoOn’s UE solution, which is now in design with a leading wireless vendor, can be seen at CEVA’s booth located at stand 1F33 in Hall 1 at Mobile World Congress from 14th to 17th of February. mimoOn are located at pavilion #99 on the main avenue.
The scalable eNodeB reference architecture targets both LTE FDD and LTE TDD, supporting various end products ranging from residential and enterprise femtocells through to high-density picocells. This reference architecture is built around homogenous CEVA-XC processors requiring minimal hardwired logic, allowing easy processor load balancing, flexibility to support multiple wireless communication standards, and C-based software development. In addition, this architecture allows simple software migration from off-the-shelf wireless infrastructures DSP chips.
With seven of the world’s top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA’s DSP technology powers one out of every three handsets worldwide. Addressing next-generation 4G terminal and infrastructure markets, CEVA’s latest generation DSP, the CEVA-XC has been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces in software, including LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.
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SOURCE CEVA, Inc.