BARCELONA, Spain Feb. 14, 2011 Mobile World Congress —
Wireless baseband technologies are evolving fast through multiple 3G and 4G standards including: HSPA+, WiMAX and LTE. Next generation wireless modems are required to address the dramatically growing complexity in multiple aspects, including: download and upload peak data rates, antenna scheme, spatial multiplexing, synchronization, and more.
"CEVA is honored to collaborate with NEC CASIO Mobile Communications for future wireless baseband technologies," said Gideon Wertheizer, CEO of CEVA. "As the world’s number one DSP architecture deployed in wireless baseband processors, we have an innate understanding of how to successfully address the growing complexity of modem processing and deliver industry-leading solutions."
With seven of the world’s top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA’s DSP technology powers one out of every three handsets worldwide. Addressing next-generation 4G terminal and infrastructure markets, CEVA’s latest generation DSP, the CEVA-XC has been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces in software, including LTE-A, LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.
About CEVA, Inc.
About NEC CASIO Mobile Communications, Ltd.
Japan U.S.A. http://www.nec-casio-mobile.com
SOURCE CEVA, Inc.