SAN JOSE, Calif. Taiwan July 27, 2011
The new S65™ process is a 65-nanometer SONOS embedded nonvolatile memory (NVM) technology. It is now successfully integrated into UMC’s standard LL65 process. Existing or new designs using the LL65 process can now easily add embedded Flash memory with fast time-to-market, low development cost, and minimum design disturbance to other IPs. The S65 offers major advantages including high endurance, low power, and resistance to soft errors. It only requires three additional mask layers to a standard CMOS process, as compared to 7-12 additional masks for other embedded FLASH technology approaches. It also offers intrinsically high yields and low test costs. Using Cypress products as a reference, the new process is expected to provide a 75 percent reduction in array size and 50 percent power reduction compared to products manufactured on the current 130-nanometer S8™ process.
"We’re excited to team with a world leader in semiconductor manufacturing to bring this outstanding technology to market," said Shahin Sharifzadeh, executive vice president of worldwide Manufacturing and Operation for Cypress. "Our product lines are eager to introduce new, high-performance products on S65, and we look forward to working with UMC to license the technology to their large customer base around the world."
"As a customer driven foundry, UMC is continuously introducing enhanced process offerings for its customers," said P W Yen, Sr. Vice President from UMC. "Today, Embedded NVM is a key feature in many IC designs. UMC has delivered a very valuable technology solution to meet customer needs through the successful S65 integration and its full compatibility with the LL65 foundry process. We look forward to ramping this process to production for Cypress and other UMC customers."
The UMC S65™ process is scheduled for availability to foundry customers in Q3, 2011.
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Note f rom UMC Concer ning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.
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SOURCE United Microelectronics Corporation; Cypress Semiconductor Corp.