FARMINGTON, Conn. May 23, 2012 /PRNewswire-iReach/
The camera is built using a wafer-level packaged CMOS image sensor and wafer-level optics. Both technologies are licensed by Tessera. This report provides a complete teardown of the camera module including material analysis, manufacturing process flow, manufacturing cost breakdown, schematic assembly description and detailed photos.
The Communication wireless segment is being driven by the exploding smart phone and tablet traffic and the four billion devices connected to the internet. 3G/4G services are where the money is for carriers going forward and the wireline and optical networks are gearing up for upgrades to support the ever increasing traffic.
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