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EDI CON 2013 – Electronic Design Innovations Conference for RF, Microwave, Wireless and High Speed Digital Design and System Integration in China

NORWOOD, Mass. May 22, 2012 Electronic Design Innovation Conference EDI CON 2013 Beijing, China March 2013

The conference program is being developed in partnership with industry and local academia and will feature the latest design techniques and technologies, workshops for advanced professional education and product training, business panel discussions of market trends, an exhibition of leading microwave companies, keynote talks from industry executives and government officials as well as a networking reception. 

China Platinum Sponsor


"We are proud to be an EDI CON, Platinum Sponsor. Agilent is well equipped to deliver solutions that address high-speed, high-frequency needs in microwave and RF test, both at the design and physical layers of test," said Guy Sene, senior vice president of Agilent Technologies Inc., and president of Agilent’s Electronic Measurement Group. "Our engagement in current and rapidly emerging technologies delivers practical hands-on engineering test solutions for those at the exhibition and conference. EDI CON is designed to help attendees achieve the knowledge and skill development needed to meet the accelerating technology and market demands of today."


Ivar Bazzy China

Microwave Journal China, a Horizon House Publication and sister magazine of Microwave Journal, will actively promote and publicize EDI CON 2013 to local engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community.

SOURCE Horizon House Publications

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