SANTA CLARA, Calif. Feb. 22, 2011
Farmington, Conn. $10.09 billion $46.05 billion
As with its dedicated EVG560HBL automated wafer-bonding system, introduced last July, EVG developed the EVG620HBL aligner to address these needs. EVG is not new to this market – its bonders and mask aligners are being deployed by four of the top five major HB-LED manufacturers. Building on this success, the company created the 620HBL in response to customer demand for a mask alignment system dedicated to meeting these devices’ yield and throughput requirements.
Another key feature of the EVG620HBL is the availability of special recipe-controlled microscopes whose illumination spectrum is optimized to ensure the best pattern contrast with various wafer and layer materials, including such advanced substrate materials as sapphire, silicon carbide (SiC), aluminum nitride (AlN), metal and ceramic.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
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SOURCE EV Group