ST. FLORIAN Austria May 24, 2012
This year’s VLSIresearch customer satisfaction survey represents feedback from more than 99 percent of the global chip market, garnered over a period of more than two months. Participants were asked to rate equipment suppliers among 15 categories based on three key factors: supplier performance, customer service, and product performance. EVG soared from the fifteenth position in 2011 to ranking fourth in 2012 in the 10 BEST Focused Suppliers category – the company’s first-ever appearance on one of the two most important, aggregated 10 BEST Suppliers of Chip Making Equipment lists. In addition, its third-place spot among THE BEST Small Suppliers of Wafer Processing Equipment was a three-position jump from last year’s survey results.
G. Dan Hutcheson
About EV Group (EVG)
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
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SOURCE EV Group