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KLA-Tencor Announces New CIRCL™ Suite

MILPITAS, Calif. April 23, 2012 KLA-Tencor Corporation

Oreste Donzella

The extensive capabilities of the CIRCL suite enable fab engineers to address a broad spectrum of yield and performance issues including:

  • Detection and binning of a wide range of macro defect types on the front side of the wafer, from particles, to defocus defects spanning several die, to full-wafer defects such as missing resist;
  • Low percentage of non-critical defects, allowing engineers to quickly and accurately disposition production material;
  • Reticle ID check, to verify that the correct reticle was used for printing;
  • Macro overlay error monitoring, to check layer-to-layer pattern registration;
  • Inspection for defects on the wafer back side, where particles and scratches can potentially affect printed pattern dimensions on the front side of the wafer;
  • Detection and binning of edge defects, which can migrate to the die area and cause yield loss;
  • Edge Bead Removal (EBR) metrology, for monitoring film concentricity and edge integrity to ward off possible delamination defects;
  • Calibrated, automated edge profile measurements, to identify excursions that can result in water bead leakage or film delamination during immersion lithography; and
  • Automated high-resolution optical defect review and automated classification of front-side, back-side and edge defects, helping engineers identify the defect source quickly.


KLA-Tencor’s global, comprehensive service network

Milpitas, Calif.

SOURCE KLA-Tencor Corporation

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