LOVELAND, Colo. Feb. 7, 2011 May 23 to 25 Denver, Colorado www.3dcic.com
- Teamwork, Social Computing and Their Impact on Simulation Driven Design?
- Managing the Braindrain Threat from Boomer Retirement
- Irreconcilable Differences? Getting Engineers from Different Generations To Work Together
- Mashups: A Killer App for Engineers?
- Is PDM-Less PLM Pragmatic or Problematic?
Chad Jackson www.engineering-matters.com/about-author
Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, Mecanica Solutions, mental images, Parametric Technology Corp., Right Hemisphere, Spatial, Technigraphics, Techsoft 3D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.
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