MOUNTAIN VIEW, Calif. Feb. 8, 2011 CEVA-XC323
The CEVA-XC323 is scalable to address the complete range of cell site solutions required by network operators, including femtocells, picocells, microcells and macrocells. Its flexible architecture provides efficient support for both legacy and next-generation wireless standards such as WCDMA, HSPA, WiMAX, LTE and LTE-A. In addition, the core incorporates extensive support for wireless infrastructure control plane processing, typically handled by separate processors.
A new class of high-performance silicon, Mindspeed®’s Transcede family of SoCs can deliver three sectors of LTE processing in a single device and enables the first 64-user "picocell on a chip." At the same time, it provides substantial processing headroom using a modular software approach that allows manufacturers to incorporate their own proprietary, value-added features to a standard eNodeB implementation, such as network listening for base station self-optimization and auto-configuration. The solution uses an innovative, task-based hardware architecture model that enables software developed on one Transcede device to be ported to other products within the Transcede family across the full range of system platforms, including enterprise femtocell, picocell (indoor and outdoor), microcell and macrocell base stations.
CEVA’s industry-leading DSP cores power many of the world’s leading wireless semiconductors, enabling unrivalled power consumption, performance and cost efficiencies in 2G / 3G / 4G solutions. The Company’s wireless customer base includes Mindspeed, Broadcom, Intel, Samsung, Spreadtrum, ST-Ericsson and VIA Telecom. CEVA has more than 35 design wins for cellular baseband processors targeting a wide range of handset, mobile broadband and wireless infrastructure applications. To date, more than 1 billion CEVA-powered cellular baseband processors have shipped.
Microprocessor Report Analysis of CEVA-XC323
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SOURCE CEVA, Inc.