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New Embedded NAND Flash Memory Devices from Toshiba Feature Toggle-Mode DDR NAND for Improved Performance

IRVINE, Calif. July 27, 2011 Toshiba America Electronic Components, Inc. (TAEC)*

Toshiba’s 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages – all of which are key requirements for space-conscious applications such as smartphones, tablet PCs, eBooks, digital video cameras, printers, servers, and POS systems.  

Integrating up to 128GB NAND and an e-MMC controller in a single package, Toshiba’s new family of 24nm e-MMC devices combine up to 16 pieces of 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba’s cutting-edge 24nm process technology.  Toshiba was the first company to succeed in combining 16 pieces of 64Gbit die in e-MMC to achieve 128GB of memory by applying advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.  Full compliance with the JEDEC e-MMC Version 4.41 (V4.41) standard for embedded MultiMediaCards supports standard interfacing and simplifies product design-in, reducing development burdens on product manufacturers.

Scott Beekman

Key Features

  • Faster performance using toggle-mode DDR NAND.
  • The JEDEC e-MMC V4.41 compliant interface handles essential functions, including writing block management, error correction and wear leveling.  It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
  • A wide product line-up supports capacities from 2GB to 128GB.
  • The 24nm 64Gbit die enables smaller e-MMC packages.
  • The new chips support the advanced partitioning and security of e-MMC V4.41.  Multiple storage areas can be configured, including several enhanced memory areas for system files or code, and a multi-level cell (MLC) area for data storage.

Samples of 8GB, 16GB, 32GB and 64GB 24nm e-MMC product family are available now, and mass production will begin in Q3, with other densities to follow.

Density

Package

Start of samples

Start of mass production

2GB

11.5×13.0x1.0mm

4Q11

1Q12

4GB

11.5×13.0x1.0mm

3Q11

4Q11

8GB

11.5×13.0x1.0mm

Now

3Q11

16GB

12.0×16.0x1.2mm

Now

3Q11

32GB

12.0×16.0x1.2mm

Now

3Q11

64GB

14.0×18.0x1.2mm

Now

3Q11

128GB

14.0×18.0x1.4mm

3Q11

4Q11

* About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs.  Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today’s leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. Japan Jan. 2011

http://www.toshiba.com/taec/

(1) Product density is identified based on the maximum density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.

e-MMC is a trademark of the MultiMediaCard Association.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.  In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook."  This information is available at www.chips.toshiba.com , or from your TAEC representative.

Editor’s Note: Product photos can be downloaded at http://www.toshiba.com/taec/news/press_releases/2011/memy_11_617.jsp

MEDIA CONTACT:
Dena Jacobson

[email protected]

SOURCE Toshiba America Electronic Components, Inc.

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