SAN JOSE, Calif. Jan. 25, 2011
The VECTOR Extreme TEOS xT system achieves its benchmark performance through a combination of several new and innovative features. Industry leading throughput is achieved using Dynamic Plasma Control (DPC™) hardware for higher deposition rates, RapidClean™ for faster chamber cleans, and a new xT™ wafer handler with enhanced control system architecture for precise wafer placement and reduced non-value-added time. The breakthrough in defectivity performance is achieved using High Conversion Efficiency (HCE™) vaporizer technology. Figure 1 shows controlled, repeatable performance of less than 10 defects per wafer throughout a 17,500 wafer marathon. In order to reduce the qualification time for TEOS applications, the new OHD™ profile package was developed to tune film thickness profiles to match chemical mechanical planarization requirements. Figure 2 shows edge thick, edge thin and flat film profiles that can be achieved using OHD technology. Compared to the competition, the advanced features on the VECTOR Extreme TEOS xT enable a 29 percent reduction in chemical costs and a 25 percent reduction in energy consumption.
About Novellus’ PECVD Technology:
The multi-station sequential processing (MSSP) architecture of Novellus’ VECTOR platform allows for independent temperature and flow control to its deposition stations, a critical requirement to meet the integration needs of sub-3xnm technology nodes. More than 1,000 VECTOR systems have been installed in logic, memory, and foundry fabs around the world.
San Jose, Calif. www.novellus.com
Novellus and VECTOR are registered trademarks; and VECTOR Extreme, TEOS xT, DPC, HCE and OHD are trademarks of Novellus Systems, Inc.
SOURCE Novellus Systems, Inc.