SANTA CLARA, Calif. Feb. 15, 2011 –
OmniBSI-2 technology is OmniVision’s first pixel architecture built on 300 mm wafers using a copper process with 65 nm design rules, developed in close cooperation with strategic manufacturing partner Taiwan Semiconductor Manufacturing Company Limited (TSMC). The new process and design rules enable a number of substantial improvements over OmniBSI™ technology’s already impressive performance, including improved pixel layout, better isolation, and significantly reduced crosstalk. As compared to OmniBSI, OmniBSI-2 technology also provides the basis for a larger collection region in the photodiode. The results include increased sensitivity, improved image quality and enhanced color reproduction, leading to more responsive overall sensor performance.
The OmniBSI-2 pixel architecture offers many performance improvements over OmniBSI technology as applied to OmniVision’s 8-megapixel sensor product portfolio. These advances include a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low-light sensitivity and a 45 percent increase in full-well capacity.
The 1/3.2-inch OV8830 image sensor offers a range of advanced features including high frame rates, an integrated scaler, and 2 x 2 binning functionality. The scaler enables electronic image stabilization, while maintaining full field of view in 1080p/30 HD video mode. The sensor’s binning functionality with post-binning re-sampling filter minimizes spatial artifacts and removes image artifacts around edges, delivering clean, crisp color images for best-in-class 720p HD video.
The OV8830 fits into the industry standard module size of 8.5 x 8.5 x 6 mm and is now available for sampling. Mass production is expected to start in the second half of 2011.
Certain statements in this press release, including statements regarding the expected benefits, performance, capabilities, and potential market appeal, as well as the anticipated timing of mass production, of the OV8830 are forward-looking statements that are subject to risks and uncertainties. These risks and uncertainties, which could cause the forward-looking statements and OmniVision’s results to differ materially, include, without limitation: potential errors, design flaws or other problems with the OV8830, customer acceptance, demand, and other risks detailed from time to time in OmniVision’s Securities and Exchange Commission filings and reports, including, but not limited to, OmniVision’s annual report filed on Form 10-K and quarterly reports filed on Form 10-Q. OmniVision expressly disclaims any obligation to update information contained in any forward-looking statement.
OmniVision® and the OmniVision logo are registered trademarks of OmniVision Technologies, Inc. OmniBSI-2™ and OmniBSI™ are trademarks of OmniVision Technologies, Inc. All other trademarks are the property of their respective owners.
SOURCE OmniVision Technologies, Inc.