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Qualcomm Announces Chipset with Support for Next-generation Release 9 HSPA+

BARCELONA, Spain Feb. 14, 2011

Cristiano Amon

Neville Ray

The new chipsets will support HSPA+ MIMO antenna technology simultaneously with HSDPA carrier aggregation on the downlink to deliver higher data rates to users.  The dual-carrier HSDPA feature will also support aggregation of carriers from different frequency bands and will give network operators greater flexibility in the use of their allocated radio spectrum to deliver doubled data rates for faster mobile broadband connectivity.  Additionally, MDM8225 will support dual-carrier HSUPA operation to double uplink user data rates.  The MDM8225 chipsets will support the latest Qualcomm Interference Cancellation & Equalization (Q-ICE) receiver, a feature that removes interference in a cellular network to increase network capacity and enhance the mobile broadband user experience.

The new chipsets will integrate a dedicated processor that will allow OEMs to develop new product classes and services at a lower cost.  For example, OEMs will be able to develop WiFi hotspot products without requiring an external application processor.  The MDM8225 will pair up with the WTR1605 radio frequency IC and PM8018 power management IC to provide a highly integrated chipset solution.

The MDM8225 chipset will support all major 3GPP radio bands, including the 1800 MHz band. As operators plan to refarm their 1800 MHz spectrum to provide for additional data capacity, the MDM8225 will add to Qualcomm’s family chipsets that will support HSPA+ in the 1800 MHz band.

Samples of the MDM8225 are anticipated to be available in Q4 2011.

About Qualcomm  

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and next-generation mobile technologies.  For 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other.  Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere.  For more information, visit Qualcomm around the Web:

www.qualcomm.com

Corporate Blog: www.qualcomm.com/blog

Twitter: www.twitter.com/qualcomm

Facebook: www.facebook.com/qualcomm

September 26, 2010

Qualcomm is a registered trademark of Qualcomm Incorporated.  Mobile Data Modem, MDM and MSM8225 are trademarks of Qualcomm Incorporated.  All other trademarks are the property of their respective owners.

Qualcomm Contacts:

Tina Asmar, Corporate Communications

Phone:  1-858-845-5959

Email:  [email protected]

Warren Kneeshaw, Investor Relations

Phone:  1-858-658-4813

Email:  [email protected]

SOURCE Qualcomm Incorporated

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