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Texas Instruments DLP® Announces Optimized Chipsets to Enable Brighter Images Using Less Power for Mobile and Embedded Pico Projector Users

BARCELONA, Spain Feb. 14, 2011

http://photos.prnewswire.com/prnh/20110201/LA39249LOGO

Frank Moizio

TI DLP Pico chipsets enable multimedia content to be displayed brighter than ever before, and with power-optimized lower voltage technology, battery consumption is kept to a minimum.  Along with integration with the TI Analog ASIC – PAD 1000, these chipsets will enable a lower bill of material cost, smaller engine form factors and lower power requirements.

The specifications for the two chipsets are as follows:

VGA

  • 4×3 aspect ratio
  • Compatible with digital camera and camcorder formats
  • Increased power efficiency due to lower voltage process technology enabling maximum brightness in embedded devices
  • Height optimized for the most contemporary form factors
  • 640×480 resolution

WVGA

  • 16×9 aspect ratio
  • Compatible with preferred display formats for mobile phones
  • Increased power efficiency due to lower voltage process technology enabling maximum brightness in embedded devices
  • Height optimized for the most contemporary form factors
  • 854×480 resolution

The latest DLP Pico chipsets can be found at the heart of a growing number of all-new product types. To experience firsthand the full breadth of new and upcoming products equipped with Texas Instruments DLP Pico technology, along with other DLP innovations, be sure to check us out at stand 8A84 (Hall 8) at Mobile World Congress.

February 14 12 p.m. CET @TI_DLP YouTube.com/DLPTechnology

DLP.com/CES2011

About Texas Instruments DLP Products

www.DLP.com www.Twitter.com/TI_DLP

About Texas Instruments

www.TI.com

SOURCE Texas Instruments DLP

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