DALLAS May 23, 2012
Wire bonding technology connects the silicon die pads and semiconductor package leads with thin wires. TI was an early leader in the pursuit, development and implementation of copper wire bonding technology as an alternative to gold. After several years of research, development and product qualifications, TI proved that copper wire bonding is a high volume production process across a wide variety of products with equal or better manufacturability compared to gold, and TI’s customers have benefitted from its differentiation. Copper provides superior electrical performance with 40 percent higher electrical conductivity, resulting in lower operating resistance. This, in turn, improves overall product performance in high-speed digital, high-current mixed signal, and power management applications.
TI began shipping copper wire in its products in 2008, making the company an industry leader in broad fan-out of the technology. Today, all seven of TI’s assembly and test (A/T) sites are running copper wire bonding production across a range of products and package types, including quad flat no lead (QFN) packages, ball grid array packages such as nFBGA and PBGA; package-on-package (PoP); QFPs; TQFPs; TSSOPs; SOICs; PDIPs and others.
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SOURCE Texas Instruments Incorporated