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TI’s PowerStack™ packaging technology in volume production

DALLAS July 27, 2011 PowerStack™ packaging technology

Matt Romig

PowerStack technology’s benefits are achieved through an innovative packaging approach where TI’s NexFET™ power MOSFETs are stacked on a grounded lead frame, using two copper clips to connect the input and output voltage pins. This unique combination of stacking and clip bonding results in a more integrated quad flat no-lead (QFN) solution.

www.ti.com/powerstack

Jan Vardaman

PowerStack is in volume production today at TI’s Clark facility.

the Philippines

www.ti.com/powerstack-pr-mfg

Advancing analog through packaging leadership

www.ti.com/powerstack-pr-pkg

About TI’s NexFET power MOSFET technology

TI’s NexFET power MOSFET technology improves energy efficiency in high-power computing, networking, server systems and power supplies. These high-frequency, high-efficiency analog power MOSFETs gives system designers access to the most advanced DC/DC power conversion solutions available.

www.ti.com/powerblock-pr

About Texas Instruments

www.ti.com

Trademarks

PowerStack and NexFET are trademarks of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

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