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TI’s PowerStack™ packaging technology in volume production

DALLAS July 27, 2011 PowerStack™ packaging technology

Matt Romig

PowerStack technology’s benefits are achieved through an innovative packaging approach where TI’s NexFET™ power MOSFETs are stacked on a grounded lead frame, using two copper clips to connect the input and output voltage pins. This unique combination of stacking and clip bonding results in a more integrated quad flat no-lead (QFN) solution.

Jan Vardaman

PowerStack is in volume production today at TI’s Clark facility.

the Philippines

Advancing analog through packaging leadership

About TI’s NexFET power MOSFET technology

TI’s NexFET power MOSFET technology improves energy efficiency in high-power computing, networking, server systems and power supplies. These high-frequency, high-efficiency analog power MOSFETs gives system designers access to the most advanced DC/DC power conversion solutions available.

About Texas Instruments


PowerStack and NexFET are trademarks of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

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