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Tyco Electronics’ Bi-Directional, Silicon-Based ESD Protection Devices Help Reduce Assembly Challenges

MENLO PARK, Calif. Feb. 2, 2011

The SESD0201P1BN-0400-090 (0201 package) and SESD0402P1BN-0450-090 (0402 package) devices’ bi-directional operation facilitates placement on the printed circuit board (PCB) without orientation constraints and eliminates the need for polarity inspection. Unlike conventional ESD diode packaging using pads on the bottom of the device, the ChipSESD devices’ passive package also allows for easy solder inspection after the device has been mounted on the PCB.

The ChipSESD devices feature a surge rating of 2A under 8x20us surge and an ESD rating of 10kV contact discharge. The devices’ low-leakage current (1.0uA max) reduces power consumption and a fast response time (<1ns) helps equipment to pass IEC61000-4-2, level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for helping to protect:

  • Cellular phones and portable electronics
  • Digital cameras and camcorders
  • Computer I/O ports
  • Keypads, low voltage DC lines, speakers, headphones and microphones

Nicole Palma


SESD0201P1BN-0400-090 (EIA-0201 package) — $0.105 for 15Kpcs

SESD0402P1BN-0450-090 (EIA-0402 package) — $0.080 for 10Kpcs

Availability :

Prototype samples available now


16 weeks ARO


US$12.1 billion

TE (logo) and Tyco Electronics are trademarks of the Tyco Electronics group of companies and its licensors.


Product Communications:

Nicole Palma

Product Manager

[email protected]

(650) 361-3219

Media Communications

Hope-Sutton Salvador

Manager Marketing Communications

[email protected]

(650) 361-2160

SOURCE Tyco Electronics

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