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UBM TechInsights First to Analyze Samsung’s 30nm-class DDR3 DRAM

OTTAWA, Ontario Jan. 28, 2011

February 2010

UBM TechInsights’ analysis reveals that this new Samsung DRAM features double the memory density with only a 20% increase in die size over the previous generation. The 2Gbit die, labeled K4B2G0846D, revealed a measurement of 36mm2 as compared to the previous 1 Gbit die at the 48nm process node, which featured a measurement of 30mm2.  

Arabinda Das

UBM TechInsights’ leading-edge forensic technical analysis techniques, combined with years of experience in all aspects of the IP / Technology Lifecycle, enable the discovery and analysis of advanced devices such as Samsung’s DDR3 DRAM.  

About UBM TechInsights

SOURCE UBM TechInsights

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